Casela Technologies Launches ELSA-16 Platform to Revolutionize AI Optical Interconnects
TL;DR
Gain a competitive edge with Casela's ELSA-16, offering customizable power profiles and broad wavelength support for high-performance AI systems.
Casela's ELSA-16 integrates 16 high-power DFB lasers with advanced control electronics, customizable to specific power, wavelength, and efficiency needs.
Casela's ELSA-16 enhances optical interconnects, paving the way for more efficient, scalable, and cost-effective AI systems, benefiting society with advanced technology.
Experience the future of AI infrastructure with Casela's ELSA-16, showcasing 16-wavelength versions at OFC 2025, redefining scalability in optical networks.
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Casela Technologies announced the launch of ELSA-16, a next-generation 16-channel External Laser Source platform designed to enhance performance, flexibility, and scalability in Co-Packaged Optics and silicon photonics systems powering AI workloads. Engineered for evolving AI infrastructure demands, the platform integrates 16 high-power Distributed Feedback lasers with advanced control electronics in a thermally optimized form factor, featuring optional Thermoelectric Cooler integration for wavelength stability and polarization-maintaining fiber outputs with OSFP electrical interface.
The ELSA-16 platform offers customizable power profiles supporting 150-200 mW per channel, broad wavelength support including 1310nm and CWDM-4 options, and comb source capability enabling up to 128 optical channels through 16 x 8 configurations. This scalability is particularly significant for AI and high-performance computing systems requiring ultra-efficient, high-bandwidth input/output operations. The platform's future-ready design includes support for tighter wavelength spacing and dynamic control to accommodate evolving CPO architectures.
At OFC 2025, Casela demonstrated a 16-wavelength version powering dense comb sources to showcase the platform's potential for supporting 128+ channels in compact form. The technology addresses critical industry needs for multi-wavelength roadmaps, serial and parallel interface demands, and high-efficiency packaging required for future optical interconnect systems. According to company leadership, the platform represents a significant advancement in flexible and scalable external laser sources, enabling high-bandwidth chiplet input/output and dense wavelength division multiplexing for next-generation optical networks.
The ELSA-16's industry-leading wall plug efficiency and precise wavelength control provide a clear path toward more compact, power-efficient, and cost-effective optical interconnects at the silicon level. This development comes as AI infrastructure continues to demand unprecedented levels of performance and scalability, making Casela's innovation particularly timely for data center and telecommunications applications requiring advanced optical integration solutions.
Curated from News Direct
